Thermal management is one of the most difficult challenges engineers face in developing next-generation fighters, particularly with RCS and range.

Femtosecond laser-induced periodic surface structures can be used to control thermal conductivity in thin film solids, report researchers from Japan. Their innovative method, which leverages ...

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

ATLANTA--(BUSINESS WIRE)--Imagine that when engineering any single electronic device, one of the biggest challenges is how to dissipate its operational heat. Carbice is an advanced materials company ...

Self-powered ferroelectric photodetectors offer an attractive platform for low-power optoelectronics, exploiting intrinsic bulk photovoltaic effects to achieve bias-free operation. However, their ...

Engineers often consider thermal management and cooling as a two-part problem. First, there’s the global “macro” case where no individual component is excessively hot, but the aggregate heat buildup ...