Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design firms amid intensifying US-China trade tensions. Effective January 31, 2025, ...